Flexible
Board Capability |
Item |
Parameter |
| Base
Material |
Polyimide |
12.5um¡¢25um¡¢50um |
| Polyester |
100um |
| Copper
Thickness |
18um¡¢35um¡¢70um
|
| Monthly
Capacity |
10,000©O/month(S/S
DS & Multi-Layer) |
| No.
of Layers |
1-6
layers |
| Max.
Board Size |
S/S
D/S M. Board |
500*500mm |
| NPTH |
¡À0.05mm |
| Hole
Dia. Tolerance |
PTH |
¡À0.076mm |
| Min.
Hole Diameter |
0.2mm |
| Min.
L/W L/Spacing |
3mil |
| Min.
Annular Ring Width |
4mil |
| Surface
Finish Immersion |
Immersion
gold/Immersion silver/Immersion tin/Gold plating/Tin plating/OSP |
| Min.
Outline Tolerance |
¡À0.05mm |
| E-test |
Voltage):10-300v;(Insulation
Resistance):1-20M¦¸; |
| Insulation
Resistance |
1011¦¸ |
| Peel
off Shock Resistance |
1.0N/mm |
| Thermal
shock Resistance |
260¡æ
10sec 3times |
| Flammability
Rate |
94V-0 |
| Quality
Standard |
IPC-6013A, Class II |
|
