Rigid
Board Capability |
Item |
Parameter |
| Base
Material Thk. |
D.S. |
0.2-3.2mm |
|
MLB |
0.4-3.2mm |
| Max.
Board Size |
D.S. |
700*800mm |
| MLB |
600*800mm |
| Monthly
Capacity |
Rigid
PCB |
10,000©O(DS&Multi-Layer) |
| Hole
Dia. Tolerance |
NPTH |
¡À0.05mm |
| PTH |
¡À0.076mm |
| Min.
Hole Diameter |
0.1mm |
| Min.
Hole to Hole Tol. |
¡À1mil |
|
Min. L/Width L/spacing |
4
mil |
| Solder
Mask Hardness |
¡Ý6H |
| Surface
Finish |
Immersion
gold/Immersion Silver/Immersion tin/Lead-free HASL/Gold plating/OSP |
| Outline
Tolerance |
CNC
Rout |
¡À0.1mm |
| Punch |
¡À0.13mm |
| V-cut
Min. Board Thk. |
0.4mm |
| E-test |
Voltage:10-300v;Insulation
Resistance:1-20M¦¸; |
| Peel
off Strength |
1.4N/mm |
| Thermal
shock Resistance |
260¡æ
10sec 3times |
| Flammability
Rate |
94V-0 |
| Warp
and Twist |
¡Ü1% |
| Quality
Standard |
GB4588.2;GB4588.4;IPC-600G,
Class II/AQL-¢ò |
|
